The Board of Directors of Mi TECHNOVATION BERHAD wishes to announce that the Company had on 5 August 2021, via its wholly-owned subsidiary, Suzhou Mi Equipment Co Ltd ("Mi Equipment China"), entered into a capital increase agreement with Talentek Microelectronics (Hefei) Limited ("Talentek Microelectronics"), Lansus Technologies Inc and Wuhan Silicon Integrated Co Ltd, to subscribe for the increase in capital of Talentek Microelectronics amounting to RMB45.00 million (equivalent to approximately RM29.36 million) ("Proposed Subscription").

Please refer to the attachment for further details of the Proposed Subscription. 

This announcement is dated 5 August 2021.